Chip Systems

Gas distribution ring for the production of computer chips

The ceramic gas distributor ring for coating chips using the PE-ALD (Plasma Enhanced Atomic Layer Deposition) process is one of the most complex parts that Alumina Systems has ever produced. The aluminum oxide ring has an impressive diameter of 380 mm and consists of three horizontally divided rings that are joined with glass solder. In addition, 3D printed ceramic nozzles made of 99.99% Al₂O₃ have been soldered in at the same time for internal gas distribution. The ring can supply the coating chamber with 2 gases (precursors) at the same time and is still thinner than the first version for only one gas.

To make things even more complicated, the gas connection for the precursors is made with a titanium tube, which is then soldered to two 3D-printed stainless steel lines. Both metal solderings are attached via a downstream active soldering process. All joining processes are cascaded in terms of temperature control, i.e. the process with the highest temperature must be carried out first, further processes must always be at a lower temperature so that previous solder joints do not “open up” again. With the exception of the metal parts, the components and joining processes were manufactured or carried out at Alumina Systems in Redwitz.

After sintering, the horizontally split rings must lie within relatively narrow tolerances for flatness and roundness, otherwise this can no longer be corrected with the subsequent grinding process for technological reasons. This is not so easy to achieve due to the shrinkage process of around 20%. The Laval nozzles also posed a challenge, as they could not have been manufactured without a 3D printer. In addition, the entire ring is He leak-tight up to 10^-8 mbar-L/s”

Aluminum oxide ceramic 3D printing